• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Metallization for a ceramic (10) comprises: a base layer (12) exhibiting a metal; an adhesive layer (14), which comprises palladium, and exhibits a layer thickness of 0.1-5 mu m; a solderable layer (16) of a non-ferromagnetic material, where the material of the adhesive layer is different from the material of the solderable layer; and an oxidation protecting layer (20). Independent claims are also included for: (1) the ceramic comprising the metallization; and (2) a cavity housing for receiving a structural element comprising a bottom portion and a covering part, respectively exhibiting the ceramic.
    公开号:NL2007028A
    申请号:NL2007028
    申请日:2011-06-30
    公开日:2012-01-02
    发明作者:Richard Gruenwald
    申请人:Vectron Internat Gmbh & Co Kg；
    IPC主号:
    专利说明:

    P95277NL00
    Title: Metallization for cavity room enclosures and non-magnetically hermetically sealed cavity room enclosures
    Description
    The invention relates to a metallization for a housing technology, for example for surface wave components (for example Surface Acoustic Wave or SAW), for use in strong magnetic fields, for example in nuclear magnetic imaging systems (also known as Magnetic Resonance Imaging or MRI systems) ) as well as non-magnetically hermetically sealed cavity enclosures.
    State of the art
    With high-resolution MRI systems, a large number of magnetic induction coils are used, the signals of which are usually processed via separate electronics. After this electronics are, as a rule, completely operated in the interior of an MRI system, it is necessary to avoid field disturbances that all the components used are completely non-magnetic, i.e. does not exhibit ferromagnetic materials.
    To achieve building elements that are stable over the long term, hermetically sealed housings are required, as a result of which technologically simple solutions such as, for example, based on printed circuit board material are not useful for reliability. The invention relates to the further development of tabulated technology based on multilayer ceramics, the variant based in industry based on the nickel content in the ceramic coating and the iron, nickel and cobalt content (Kovar, FeNi42 etc.) in the welded or soldered lid is not effective.
    In MRI systems, frequency filtering is required in addition to the signal-producing induction coils and immediately before a first signal processing. Nowadays, for these filtering purposes, mainly discrete filters are used that are made up of non-magnetic coils and capacitors. Disadvantages of these filters include: a discrete construction that requires a lot of space, aligning a necessary manual frequency and therefore high labor costs as well as a low slope of the filter. The use of surface acoustic wave filters (also known as SAW filters) leads to a considerable solution for the aforementioned intolerances, nevertheless, tabulated housing technologies are largely unsuitable due to their magnetic properties.
    The demand for long-term stability of the filters limits the avoidance of such contaminants and aging of the micro-acoustically active structure on the surface of the piezoelectric crystal and thus the necessity for hermetically sealed enclosures. These are realized in the SAW technique, especially when filtering a similarly sized design, preferably on the basis of metal or ceramic multi-layer housings, where both technologies usually use ferro-magnetic materials. The former consisting of iron alloys, ceramic housings use nickel-containing metallization systems for internal and external conduction structures that exhibit inadmissibly strong magnetic properties. Moreover, even stronger magnetic properties result from the customary closure of used nickel-coated lids of iron-nickel-cobalt (Kovar) alloys, which are either soldered or welded to the housing, in the latter case to an underlying sealing ring, on usual way from Kovar,
    Newer (for example Chip Scale Package or CSP) housing technologies for SAW components mainly concentrate on small designs and thus initially on high-frequency filters, inter alia for mobile telephone applications.
    Because of, for example, MRI applications necessary and usually relatively low filter center frequencies below or not substantially above 100 MHz, these technologies are not useful for the application described for various reasons.
    US 7,253,029 B2 discloses a technology in which, in order to avoid magnetic properties, the nickel-bonding layer customary in the art directly separated from the tungsten layer is replaced by a paladium layer with similar chemical, but non-magnetic, properties. However, in order to achieve a comparable stable behavior as with conventional nickel layers - normally in thicknesses between 2 and 10 µm - in building processes such as wire bonding and soldering, a relatively thick palladium layer is required, which is cost-intensive due to the high material price of the precious metal applications is disadvantageous. Cost-effective palladium layer thicknesses of, for example, 1 µm thickness, on the other hand, do not show a suitable substrate for achieving mechanically stable wire bond connections which are of distinctive importance for the electrical contact between housing and chip.
    US 4,941,582 discloses a method for generating a solder stable layer for Low Temperature Cofired Ceramics materials (also referred to as LTCC materials) with copper-based metallization, whose process temperatures are below 1100 ° C, which are normally below 1000 ° C . However, High Temperature Cofired Ceramics materials (also known as HTCC materials, for example AbCL ceramics) require combustion temperatures of around 1500-1700 ° C, which require the use of low-melting, but also low-melting copper (melting point at around 1085 ° C) excludes directly on the ceramics and makes the use of highly meltable, but also relatively poorly electrically conductive materials such as tungsten (melting point at approximately 3422 ° C) or molybdenum (melting point at approximately 2623 ° C) imperative. LTCC materials are always used in the usual way when, in addition to the pure household purpose, additional passive components - generally capacitors, coils or also delay lines - in intermittent interstices such as described in US 4,941,582 - into which the housing is to be integrated. The disadvantages of LTCC compared to HTCC lie in the first instance with higher costs and lower mechanical stability. Palladium and nickel respectively are explicitly described in US 4,941,582 as a separation layer and thus as a diffusion block between Cu and Au.
    Goal
    It is an object of the invention to provide a metallization and housing technology which on the one hand provides a cost-effective, reliable hermetically sealed micro cavity, suitable for example for mounting SAW filter chips, and on the other hand no ferro-magnetic exhibits properties which, when used in strong magnetic fields, for example in the interior of nuclear spin tomography systems, would result in undesirable disturbances.
    Description of the invention
    The object is achieved according to the invention with the features of claim 1. Advantageous designs and further developments of the invention can be taken from the subclaims.
    The metallization for a ceramic according to the invention shows a metal-containing base layer, an adhesive layer, a solderable layer and an oxidation protection layer, the adhesive layer exhibiting palladium (preferably completely consisting of palladium) and the layer thickness of the adhesive layer between 0.1 and 5 µm furthermore, wherein the solderable layer consists of non-ferrous magnetic material (preferably copper).
    With the proposed layer system according to the invention, showing a base layer (preferably from a burned-in tungsten base metallization), a palladium bonding layer, a solderable (preferably copper) layer of sufficient thickness to guarantee a stable solder and wire bond connection ( preferably 2-15 µm), optionally an extra layer (preferably a palladium intermediate layer for further increasing the stability of the copper layer against release in zinc-containing solder) and a non-oxidizing noble metal protection layer (preferably gold) becomes the advantage of combined magnetic properties with stable behavior towards solder and wire bond and significant cost reductions compared to the system described in US 7,253,029. The optional extra layer (preferably palladium intermediate layer) fulfills the purpose of a diffusion barrier - and thus the stability increase - between, for example, copper (solderable layer) and gold (oxidation protection layer).
    The use of a palladium-based metallization and thus provided with an optional additional diffusion blockage in combination with a ceramic lid, which is selectively hermetically sealed to the underside of the housing by means of metal or glass solder, makes the realization of a hermetically sealed , completely non-magnetic housing it is possible that it is suitable for established standard assembly (die-bonded, wire-bonded) and processing processes (soldering on an application platinum).
    The base layer is preferably fired at temperatures of 1500 - 1700 ° C together with the HTCC ceramic. Preferred thicknesses of the sintered - but not metal melted - base layer are around 5 to 20 µm.
    The adhesive layer for generating good layer adhesion between the base layer (for example a tungsten base layer) and the superstructure above it - according to preferred chemical removal of oxides and a contaminant on the base layer (for example the tungsten top layer) - in a preferred thickness of 0, 1 to 5 μηι, whereby a particularly advantageous realization with a thickness of 0.3 to 1.3 µm, more preferably of 0.5 to 1.0 µm and more preferably 0.8 µm is achieved. The layer is preferably applied by a combination of electroless and galvanic barriers. A purely electroless separation does not reach sufficient layer thicknesses («0.5 µm) for achieving a stable layer adhesion.
    The solderable layer (preferably a copper intermediate layer) as a stable underlayer against release in Sn-based soft soldering processes (e.g. on the SMD side, i.e. on the external connections) is preferably galvanically separated with a thickness of 2 to 15 µm. A particularly advantageous compromise between stability and process time is achieved with 4 to 8 µm, more preferably 5 to 7 µm.
    The superimposed - optional - additional layer (palladium diffusion block) is galvanically separated in thicknesses between 0.5 and 3 µm, more preferably between 1 and 2 µm, a layer of 1 µm thickness having particularly good stability-enhancing action with a combines low separation time and accountable precious metal costs.
    The occluding oxidation protection layer (preferably a gold layer) serves for the oxidation protection and should preferably - in order to prevent the solder from becoming brittle due to increased gold concentrations in the end-user processing process - have a thickness of 0.3 to 1.5 µm wherein particularly preferred values are between 0.5 and 1 µm.
    An additional layer is preferably arranged between the solderable layer and the oxidation protection layer. The additional layer preferably consists of palladium. The additional layer preferably has a layer thickness between 0.5 and 3 µm. The adhesive layer preferably consists entirely of palladium. The adhesive layer preferably has a layer thickness between 0.5 and 1.5 µm. Preferably the base layer shows a metal with a melting point of at least 1100 ° C. The base layer preferably consists of tungsten and / or molybdenum. Preferably the base layer has a layer thickness between 5 and 20 μηι. The oxidation protection layer preferably consists of a noble metal. The oxidation protection layer preferably consists of gold. The oxidation protection layer preferably has a layer thickness between 0.3 and 1.5 μηι. The base layer is preferably arranged directly on the ceramic. The adhesive layer is preferably arranged directly on the base layer. The solderable layer is preferably arranged directly on the adhesive layer. Preferably the extra layer is directly on the solderable layer and the oxidation protection layer is arranged directly on the extra layer. Alternatively, the oxidation protection layer is arranged directly on the solderable layer.
    The ceramic according to the invention shows a metallization with at least one of the aforementioned characteristics. Preferably the ceramic is an HTCC ceramic. HTTC ceramics offer cost advantages and mechanical stability over LTCC ceramics and are therefore often used as standard housings when the performance benefits of LTCC ceramics over lower electrical losses and integration of passive components are not necessary.
    The hollow space housing according to the invention for receiving a building element shows a bottom part and a cover part, wherein the bottom part and / or the cover part has a ceramic with a metallization with at least one of the aforementioned characteristics. The building element is preferably an electronic, mechanical and / or optical building element, in particular preferably a SAW building element, more preferably a SAW filter.
    Since the hollow space housing according to the invention does not contain magnetic materials such as iron, nickel and cobalt, it is advantageously arranged so as not to change the magnetic fields. Such a housing technology is preferably used in medicine technology, for example in nuclear spine tomography, since here magnetic fields are measured for imaging and should not be influenced by the magnetic properties of the switching technology required for this purpose.
    It is furthermore preferred to use the ceramics according to the invention with the metallization according to the invention for the construction and connection processes, in particular for die-bonding such as aluminum or gold-wire bonds. The metallization device according to the invention makes it particularly suitable for wire bonding. In wire bonding, in particular in aluminum wedge wire bonding, an intermetallic connection is formed between bond wire and underlying metallization (bond path). Due to the ratio of thin and soft gold oxidation protection layer, this intermetallic connection is mainly entered between aluminum and the layer system underneath the gold. In order to achieve a stable weld connection - in particular with aluminum wire bonding - a sufficiently even surface of the bond pad is required. After the burned-in tungsten metallization has a comparable high roughness of a few µm in the usual manner, a smoothing for a stable wire connection is useful. Where copper exhibits good flattening properties and thus as a basis for a stable wire bond connection, together with an economic process for the usual necessary layer thicknesses of 2 to 15 µm, a pure palladium metallization of comparable thickness, as for example in US 7,253,029 B2, brings both disadvantages with regard to process costs as well as with regard to the stability and reliability of feasible wire bond connections.
    It can therefore be established that the metallization according to the invention offers advantages over the stability and the costs with respect to an (aluminum) wire bonding process. In the case of a metal solder closure, the metallization according to the invention offers advantages with regard to the wetting ratio for zinc-based soldering.
    The ceramic according to the invention (with the metallization according to the invention) is preferably used in a soft soldering process for providing electronic components.
    For the use of the ready-made electronic components, solderability in the system supply process of the end user is of decisive importance. For this process it is imperative that hermetic housing closure achieved by means of metal or glass solder does not melt open again, since otherwise the positioning of the housing cover and thus the hermetic closure of the component are at risk. For this reason, the metal or glass solder used for the housing closure must exhibit a higher melting temperature than the usual soft solder used in the end-user supply process, usually SnAg, SnAgCu or SnPb. Moreover, usual requirements for external solder connections - so-called "second level raliability" - entail enough mechanical stability of these external solder connections, which in turn means both good wetting - that is, alloy ratios during the soldering process, as well as the avoidance of any brittle intermetallic phases, for example due to excessive gold content in the resulting alloy of conventional soft solder such as, for example, SnAg, SnAgCu or also SnPb.
    Brief description of the figures
    The invention is further elucidated on the basis of the preferred exemplary embodiments shown in the figures. It is shown:
    FIG. 1 a ceramic with a metallization according to the invention of a preferred embodiment of the invention in a schematic sectional view,
    FIG. 2 shows a hollow-space housing according to the invention according to a preferred embodiment of the invention in a schematic cross-sectional view, and
    FIG. 3 shows a hollow space housing according to the invention according to a further preferred embodiment of the invention in a schematic sectional view.
    It is noted that the figures are only schematic representations of preferred embodiments of the invention which are described by way of non-limitative exemplary embodiments. In the figures, the same or corresponding parts are designated with the same reference numerals.
    Detailed description of the figures
    FIG. 1 shows a ceramic 10 with a metallization 30 according to a preferred embodiment of the invention. According to the embodiment, the metallization 30 consists of a tungsten-respective molybdenum base layer 12, a palladium adhesive layer 14 deposited thereon, a solderable copper layer 16 applied thereto, a palladium diffusion barrier 18 applied thereto, and a gold surface finish 20.
    In the layer system 10 according to the invention, a stable layer adhesion to the substrate, i.e. the HTCC-ceramics 10, is ensured by means of the palladium metallization 14 deposited on base layer 12, whereas the solderable layer 16 (e.g. Cu or Ag, Cu) deposited thereon is preferred ) both a stable basis for a durable wire bond connection, as well as a layer with sufficient stability against release in a soft soldering process. A further diffusion stabilization can be achieved by an additional palladium intermediate layer 18 deposited thereon, wherein to achieve an oxidation and aging stable surface, the layer system is closed off with, for example, a gold layer 20.
    The realization according to the invention is therefore suitable for conventional connection processes such as aluminum or gold wire bonds, flip chip bonds and soldering for achieving mechanical and electrically stable connections.
    FIG. 2 shows a cavity room housing according to a preferred embodiment of the invention. According to the embodiment, the hollow space housing 28 shows a tub-shaped bottom part 22 and a cover part 24. Both parts 22, 24 are formed by means of an HTCC ceramic 10 - possibly also by several layers - and have metallization 30 in their contact areas. invention consisting of layers 12, 14, 16, 18 and 20 (as shown in Fig. 1). The cavity space housing 28 can serve for the hermetic reception of a building element, for example a SAW filter 26. The resulting hollow space housing 28 is closed with a non-ferro-magnetic ceramic cover 24, which is thermally adapted to the ceramic part 22, which has an advantageous effect on the reliability of the resulting housing 28. The hermetically sealed connection between housing bottom part 22 and cover 24 can take place by conventional methods. Soft soldering (optionally through the use of high-melting solder) or glass frit soldering (optionally with similarly low-melting solder) is preferably used here.
    FIG. 2 shows a closing solution by means of metal-soft soldering, in which a metal soldering joint 32 is obtained between metal systems 30 which are always separated from the bottom part 22 and the cover 24 according to the invention. The SAW chip 26 is connected to the housing bottom part 22 by means of bonding wires 34 via the metallization 30 according to the invention.
    On the underside of the housing 28, the signal-conducting connections with the metallization 30 according to the invention are connected by means of a soldered connection 40 to the wiring 36 located on a printed circuit board 38 and thus the electrical contact is obtained.
    FIG. 3 shows an alternative embodiment according to FIG. 2 in which instead of the metal solder connections 32 (of FIG. 2) realized between two metallizations 30 according to the invention by means of a glass frit solder connection 42 directly between the ceramic surfaces 10 (ceramic base part 22 and ceramic cover 24) close closure of the housing 28 is achieved.
    The invention is not limited to the exemplary embodiments shown here. Many variants are possible and are understood to fall within the scope of the invention as set forth in the following claims.
    Reference numerals 10 Ceramic 12 Base layer 14 Adhesive layer 16 Solderable layer 18 Extra layer 20 Oxidation protection layer 22 Bottom part 24 Cover part 26 Building elements 28 Hollow room housing 30 Metallization 32 Metal solder 34 Bond wire 36 Circuit board wiring 38 Circuit board 40 Metal solder 42 Glass frit solder
    权利要求:
    Claims (15)
    [1]
    A metallization (30) for a ceramic (10), showing: - a base layer (12) showing a metal, - an adhesive layer (14) wherein the adhesive layer (14) exhibits palladium and the layer thickness of the adhesive layer (14) between 0 Is 1 and 5.0 µm, - a solderable layer (16) of a non-ferro-magnetic material, the material of the adhesive layer (14) differing from the material of the solderable layer (16), and - an oxidation protective layer (20).
    [2]
    Metallization (30) according to claim 1, characterized in that the solderable layer (16) consists of copper and / or the solderable layer (16) has a layer thickness between 2 and 15 µm.
    [3]
    Metallization (30) according to one of the preceding claims, characterized in that an additional layer (18) is arranged between the solderable layer (16) and the oxidation protection layer (20).
    [4]
    Metallization (30) according to claim 3, characterized in that the extra layer (18) consists of palladium and / or the extra layer (18) has a layer thickness between 0.5 and 3.0 µm.
    [5]
    Metallization (30) according to one of the preceding claims, characterized in that the adhesive layer (14) consists of palladium and has a layer thickness between 0.3 and 1.3 µm.
    [6]
    Metallization (30) according to one of the preceding claims, characterized in that the base layer (12) has a metal with a melting point of at least 1100 ° C.
    [7]
    Metallization (30) according to claim 6, characterized in that the base layer (12) consists of tungsten / molybdenum and / or the base layer (12) has a layer thickness between 5 and 20 µm.
    [8]
    Metallization (30) according to one of the preceding claims, characterized in that the oxidation protection layer (20) consists of gold and / or the oxidation protection layer (20) has a layer thickness between 0.3 and 1.5 μηι.
    [9]
    Metallization according to one of the preceding claims, characterized in that the base layer (12) directly on the ceramic (10) and / or the adhesive layer (14) directly on the base layer (12) and / or the solderable layer (16) is arranged directly on the adhesive layer (14).
    [10]
    Metallization according to one of the preceding claims, characterized in that the additional layer (18) or the oxidation protection layer (20) is arranged directly on the solderable layer (16).
    [11]
    A ceramic (10) showing a metallization (30) according to any one of the preceding claims.
    [12]
    A ceramic (10) according to claim 11, characterized in that, the ceramic (10) is a HTCC ceramic.
    [13]
    A hollow space housing (28) for receiving a building element (26) with a bottom part (22) and a cover part (24), the bottom part (22) and / or the cover part (24) being a ceramic (10) according to one of the claims 11 and 12.
    [14]
    A cavity room housing (28) according to claim 13, characterized in that the building element (26) is a SAW building element.
    [15]
    Use of the ceramic (10) according to one of claims 11 and 12 for mounting a building element (26) by means of a die-bond and / or wire-bond process or by means of the flip chip unions.
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    法律状态:
    2015-03-04| SD| Assignments of patents|Effective date: 20150224 |
    优先权:
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    DE102010030778|2010-06-30|
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